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dc.creatorRahman, Mohammed Mainur
dc.date.available2011-02-18T21:50:49Z
dc.date.issued2002-05
dc.identifier.urihttp://hdl.handle.net/2346/17048en_US
dc.description.abstractThe use of integrated circuit processing technology in order to manufacture Microelectromechanical systems is a relatively recent field of research. Texas Instruments, DLP™ has been the leader in optical MEMS devices, by inventing a commercially viable means of MEMS for projection displays. This thesis starts with a brief introduction to the DMD™ device, which is the heart of DLP™ technology. Then it gives a brief overview of hinge-related failures. The main objective of the thesis is to establish a relationship between hinge thickness, pre-bake temperature, and hinge sag in DMD™ devices. In order to achieve the goals of the thesis a Design of Experiments has been performed. The step-by-step approach of the experiment, the collection of data, and a detailed analysis of the results have been discussed in the thesis.
dc.format.mimetypeapplication/pdf
dc.language.isoeng
dc.publisherTexas Tech Universityen_US
dc.subjectHingesen_US
dc.subjectSemiconductor switchesen_US
dc.titleStatistical analysis of the digital micromirror devices hinge sag phenomenon
dc.typeThesis
thesis.degree.nameM.S.E.E.
thesis.degree.levelMasters
thesis.degree.disciplineElectrical and Computer Engineering
thesis.degree.grantorTexas Tech University
thesis.degree.departmentElectrical and Computer Engineering
dc.degree.departmentElectrical and Computer Engineeringen_US
dc.rights.availabilityUnrestricted.


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