Design of an automated inkless wafermap system
This project deals with developing a fully automated inkless wafermap system to implement inkless process for Texas Instruments (TI) foundry wafers. In the process, TI to TSMC (Taiwan Semiconductor Manufacturing Company) automated inkless wafermap system has been designed in accordance with TI computer integrated manufacturing inkless standards. The system developed here also can be used for other foundries and subcons. The results will be evaluated as successful when a fully automatic process of uploading Wafermaps from TSMC server to TI WISH (Wafermap Inkless System Host) system is completed. The conclusions and recommendations for future work are discussed.