Influence of nanocrystal growth kinetics on interface roughness

Date

2003-12-29

Authors

Temkin, H.
Yun, J.
Chandolu, A.
Berg, J.
Daugherty, M.
Holtz, M.
Aurongzeb, D.

Journal Title

Journal ISSN

Volume Title

Publisher

American Institute of Physics

Abstract

We study the layer morphology of Ni/Al multilayer structures, with 50 nm period, as deposited and following 10 min anneals up through the melting temperature of Al. X-ray reflectivity measurement of the as-deposited film shows interference fringes, characteristic of a well-defined multilayer stack, with ∼1 nm interface roughness. Over a narrow anneal range of 360–500 °C these fringes diminish in amplitude and disappear, indicating elevated interface roughening. However, fringes are observed for anneal temperatures both below and above this range, indicating the presence of well-defined layers with smooth interfaces. A model, in which nanocrystal domains of intermetallic nickel aluminides form at the interfaces, is developed to quantify the annealing induced interface roughness. This model agrees well with the experimental results

Description

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Citation

Influence of nanocrystal growth kinetics on interface roughness in nickel--aluminum multilayersD. Aurongzeb, M. Holtz, M. Daugherty, J. M. Berg, A. Chandolu, J. Yun, and H. Temkin, Appl. Phys. Lett. 83, 5437 (2003), DOI:10.1063/1.1637155

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