Temperature control and measurement in spike anneal
Date
2002-12
Authors
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Publisher
Texas Tech University
Abstract
Device scaling beyond O.IO um technologies is severely restricted by the lack of any "manufacturable" solutions to activate the implanted species in Ultra Shallow junctions (USJ). The hardware and process modifications were directed to improve the spike sharpness. Different designs for the edge ring and the pyrometers have been tried and successfully implemented. This dilemma is resolved with the design of a spectral coating that maximizes reflectivity in the pyrometer band pass and maximizes absorptivity in the longer wavelengths.
Description
Keywords
Rapid thermal processing, Semiconductor wafers -- Thermal properties