Study of hinge sag as a function of bake and measurement temperature for a digital micromirror device (DMD)

Date

2015-05

Journal Title

Journal ISSN

Volume Title

Publisher

Abstract

DLP’s DMD technology is a unique and revolutionary concept in the field of MEMS device. This technology is in many ways ubiquitous in peoples’ everyday lives via light projection systems. Part of the DMD superstructure is a hinge that the pixel mirror rests upon.
The sag of a hinge, i.e. hinge sag, is an important characteristic of DMD reliability and performance. Hinge sag can affect the pixel ability to transition from on and off-states. This paper is a study of how the test structure hinges sag as the function of pre-bake temperature and measurement temperature. Hinge sag has been tested over a range of measurement temperatures from 20°-150°C for parts with no prebake and 12 hour prebakes of 150°C and 200°C. It has been found that operating temperature can have a significant effect on hinge sag.

Description

Keywords

DMD, MEMS

Citation