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dc.creatorDzurny, Quinton
dc.creatorRichardson, Tra-My Justine
dc.creatorPeterson, G.P.
dc.date.accessioned2022-06-21T14:23:43Z
dc.date.available2022-06-21T14:23:43Z
dc.date.issued7/10/2022
dc.identifier.otherICES-2022-409
dc.identifier.urihttps://hdl.handle.net/2346/89860
dc.descriptionQuinton Dzurny, Georgia Institute of Technology, US
dc.descriptionTra-My Justine Richardson, NASA Ames, US
dc.descriptionG.P. Peterson, Georgia Institute of Technology, US
dc.descriptionICES201: Two-Phase Thermal Control Technologyen
dc.descriptionThe 51st International Conference on Environmental Systems was held in Saint Paul, Minnesota, US, on 10 July 2022 through 14 July 2022.en_US
dc.description.abstractAn air-cooled Temperature Swing Adsorption Compressor (AC-TSAC) has been identified as the preferred Temperature Swing Adsorption Compressor for use in long duration and space exploration missions. The AC-TSAC compresses Carbon Dioxide (CO2) by thermally cycling an adsorbent material from 20�C to 200�C. Heat pipes and vapors have low mass and a high effective thermal conductivity, and it is desirable to use heat pipes and vapor chambers (HP/VC) in a new AC-TSAC design. For this to be possible, the HP/VC must be properly designed for the 20�C to 200�C temperature range. An important first step of this design process is identifying working fluids and envelope materials that can be used for the HP/VC across this temperature range. In this paper, a detailed selection process is followed to identify said working fluids and envelope materials. Comparison criteria are established, and identified solutions are then compared. This paper details the efforts to find working fluid and envelope material for HP/VC.
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisher51st International Conference on Environmental Systems
dc.subjectHeat pipes and vapor chamber
dc.subjectWorking fluid
dc.subjectEnvelop material
dc.subjectWick structure
dc.subjectroom temperature range
dc.titleWorking Fluid and Material Selection for Heat Pipes and Vapor Chambers for use in Air-Cooled Temperature Swing Adsorption Compression Systems
dc.typePresentationen_US


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