Temperature control and measurement in spike anneal

dc.creatorKenkare, Nilesh
dc.date.available2011-02-19T00:58:44Z
dc.date.issued2002-12
dc.degree.departmentElectrical and Computer Engineeringen_US
dc.description.abstractDevice scaling beyond O.IO um technologies is severely restricted by the lack of any "manufacturable" solutions to activate the implanted species in Ultra Shallow junctions (USJ). The hardware and process modifications were directed to improve the spike sharpness. Different designs for the edge ring and the pyrometers have been tried and successfully implemented. This dilemma is resolved with the design of a spectral coating that maximizes reflectivity in the pyrometer band pass and maximizes absorptivity in the longer wavelengths.
dc.format.mimetypeapplication/pdf
dc.identifier.urihttp://hdl.handle.net/2346/22426en_US
dc.language.isoeng
dc.publisherTexas Tech Universityen_US
dc.rights.availabilityUnrestricted.
dc.subjectRapid thermal processingen_US
dc.subjectSemiconductor wafers -- Thermal propertiesen_US
dc.titleTemperature control and measurement in spike anneal
dc.typeThesis
thesis.degree.departmentElectrical and Computer Engineering
thesis.degree.disciplineElectrical and Computer Engineering
thesis.degree.grantorTexas Tech University
thesis.degree.levelMasters
thesis.degree.nameM.S.E.E.

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