Heat Storage Panel Using a Phase-change Material Encapsulated in a High-thermal conductivity CFRP for Micro Satellites

Thermal control of small, micro and nano satellites is very difficult mainly due to power/ mass restrictions and small heat capacity. In order to satisfy the thermal requirements for these satellites, it is required to develop new thermal control devices and methodology. In Nagoya University, a new thermal control device, named heat storage panel (HSP) is currently under development. The HSP consists of a phase change material (PCM) and a thin panel-shaped container. The container is made of a high-thermal-conductivity pitch- based carbon fiber reinforced polymer (CFRP). PCM is used to increase the apparent heat capacity with a small mass gain. The high-thermal conductivity CFRP is used to enhance heat dissipation. In other words, the HSP can be used as a heat absorber/heater around the phase-change point of the PCM, and also be used as a thermal doubler. In this paper, concept, design, fabrication, and thermal test results of the HSP are presented.