The product mix problem for manufacturing of silicon wafers by diffusion process

Date

1988-08

Journal Title

Journal ISSN

Volume Title

Publisher

Texas Tech University

Abstract

In silicon wafer manufacturing there are several types of processes conducted in diffusion furnaces with different processing times. Each of these furnaces is dedicated for one type of process. The same type of process can be performed on any of the available furnaces dedicated for that particular process. These furnaces can be grouped in a single aisle or several aisles. The silicon wafers go through a series of controlled environment diffusion furnaces. These furnaces are rarely used to their capacity. A typical efficiency of these furnace tubes is somewhere between 28 to 35% [9]. This efficiency can be increased by assigning the proper number of wafers to these furnace tubes. The problem of finding the number of tubes required for each process to maximize the production is dealt with in this study.

Description

Keywords

Semiconductor wafers, Integrated circuits

Citation