Comparison of Exploration Portable Life Support Subsystem (xPLSS) Thermal Modeling to Thermal Vacuum Testing

Date

2024-07-21

Journal Title

Journal ISSN

Volume Title

Publisher

2024 International Conference on Environmnetal Systems

Abstract

To support NASA's goal to return to the Moon through the Artemis Mission, the development of an Exploration Portable Life Support Subsystem (xPLSS) has been conducted at Johnson Space Center (JSC). As part of this development process, a large system level thermal/fluid model of the xPLSS was developed using Thermal Desktop and an in-house human model (METMAN). The xPLSS model was used throughout the design process to predict the performance and temperature of nearly all components within the xPLSS.

In the fall of 2023, the Design, Verification, and Testing (DVT) unit of the xPLSS was tested in a thermal vacuum (TVAC) chamber at JSC. This testing consisted of combining the xPLSS with an upper torso of the Exploration Pressure Garment System (xPGS) and simulating five Extravehicular Activities (EVAs) in extreme thermal conditions (two cold EVAs and three hot EVAs). The data generated in this test series provided system level data of the xPLSS operating in vacuum and at flight-like environmental temperatures for the first time. These data were compared to results output by the xPLSS system model to assess the accuracy of previous analyses and improve the fidelity and accuracy of the xPLSS system model. The comparison between model and test hardware provides valuable insight that will help improve the design and fidelity of next generation space suits.

Description

Chane Sladek, HX5, LLC, USA
Noah Andersen, HX5, LLC, USA
Emma Goodman, Jacobs Engineering, USA
Michael Lewandowski, Jacobs Engineering, USA
David Westheimer, NASA Johnson Space Center (JSC), USA
ICES408: Extravehicular Activity: xEMU Thermal Vacuum Testing
The 53rd International Conference on Environmental Systems was held in Louisville, Kentucky, USA, on 21 July 2024 through 25 July 2024.

Keywords

PLSS, xEMU, Thermal Vacuum Testing, TVAC, Thermal Desktop, Thermal Modeling, Fluid Modeling

Citation