HfO2 gate dielectric with 0.5 nm equivalent oxide thickness

dc.contributor.authorTemkin, H.en_US
dc.contributor.authorGangopadhyay, S.en_US
dc.contributor.authorNikishin, S.en_US
dc.contributor.authorKipshidze, G.en_US
dc.contributor.authorBiswas, N.en_US
dc.contributor.authorChandolu, A.en_US
dc.contributor.authorMehta, N.en_US
dc.contributor.authorChoi, K.en_US
dc.contributor.authorHarris, H.en_US
dc.date.accessioned2010-11-08T19:29:03Zen_US
dc.date.accessioned2012-05-13T17:50:40Z
dc.date.available2010-11-08T19:29:03Zen_US
dc.date.available2012-05-13T17:50:40Z
dc.date.issued2002-08-05en_US
dc.description.abstractHafnium dioxide films have been deposited using reactive electron beam evaporation in oxygen on hydrogenated Si(100) surfaces. The capacitance–voltage curves of as-deposited metal(Ti)–insulator–semiconductor structures exhibited large hysteresis and frequency dispersion. With post-deposition annealing in hydrogen at 300 °C, the frequency dispersion decreased to less than 1%/decade, while the hysteresis was reduced to 20 mV at flatband. An equivalent oxide thickness of 0.5 nm was achieved for HfO2 thickness of 3.0 nm. We attribute this result to a combination of pristine hydrogen saturated silicon surfaces, room temperature dielectric deposition, and low temperature hydrogen annealingen
dc.identifier.citationHfO[sub 2] gate dielectric with 0.5 nm equivalent oxide thickness H. Harris, K. Choi, N. Mehta, A. Chandolu, N. Biswas, G. Kipshidze, S. Nikishin, S. Gangopadhyay, and H. Temkin, Appl. Phys. Lett. 81, 1065 (2002), DOI:10.1063/1.1495882en
dc.identifier.urihttp://hdl.handle.net/2346/2090en_US
dc.language.isoen_USen
dc.publisherAmerican Institute of Physicsen
dc.relation.ispartofseries81;6en_US
dc.titleHfO2 gate dielectric with 0.5 nm equivalent oxide thicknessen
dc.typeArticleen
ttu.departmentNano Tech Center (NTC)en
ttu.emailgango@ttu.eduen

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