Yield-reliability modeling: Application to large processors

Date

2005-12

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Abstract

This thesis describes an experiment that was performed on a large processor with embedded static random access memory (SRAM) with built-in redundancy, manufactured using modern very large scale integration (VLSI) technologies. This experiment will serve to prove the hypothesis that redundant SRAM on a large processor can be used for reliability modeling not only for the SRAM, but also for the functional areas of the device. In order to apply the results of this experiment to production methodology, an existing model that can give the probability of a device failing after it has been repaired using redundant SRAM will be presented and verified. This model can serve as a filter for devices that enter reliability testing, which is costly and time consuming.

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Keywords

Semiconductor, Burn-in, Failure, Defect, Killer

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